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BroadLight Secures Patent for High-Speed Internal Bus Architecture in GPON Semiconductors
Wednesday, June 04, 2008
Santa Clara, CA -- BroadLight, the leading supplier of GPON semiconductors and software, today announced that it has received a U.S. patent, number 7,370,127, which enables high-speed interconnect communication in a GPON design. BroadLight has already secured Intellectual Property throughout the GPON System and the addition of this patent further strengthens its competitive position.
"BroadLight’s systems-level expertise in GPON enabled us to redesign the internal bus architecture to provide a significant increase in performance," said Dudu Avishai, Director of VLSI for BroadLight. "This is extremely advantageous to our customers who need to deliver the highest bandwidth possible in a GPON design so that service providers can deploy true Triple Play."
The patent describes internal bus architecture capable of providing high speed inter-connection and inter-communication between modules connected in an integrated circuit. This innovative concept enable none blocking with virtually unlimited capacity of data traffic between peripherals and processing elements without the penalty of complex backend flow in SoC design.
BroadLight delivers the industry’s only end-to-end (E2E) solution (from the customer premises to the central office) for equipment vendors designing ITU-T compliant passive optical network (PON) systems. The company’s completely integrated product line consists of standards-based communication semiconductors and software solutions that enable its customers to deliver BPON and GPON equipment to carriers and services providers worldwide. This E2E solution provides customers with a lower risk development cycle and enables them to significantly speed time-to-market. As a result, BroadLight technology has been adopted by leading manufacturers who are currently providing equipment for some of the world’s largest fiber PON roll-outs.
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