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AmeriChip International Inc. Prepares to File New Process Patent
Wednesday, August 20, 2008
AmeriChip International Inc. (OTCBB: ACII) announced today that the process patent, including recent enhancements, for the utilization of the Company's existing Laser Assisted Chip Control technology (LACC) is being prepared for filing.
The Company announced as a result of the research and base line testing conducted recently that it has enhanced the control depth of the laser application thus optimizing the overall operation.
This new patent pending affords AmeriChip and its customers a distinct competitive advantage and is applicable to numerous industries.
The patent pending will be for the standard 20-year life span that will continue to protect the LACC technology going forward.
Headquartered in Clinton Township, MI, USA AmeriChip International Inc., a patented technology company, holds a patented technology known as Laser Assisted Chip Control, which can be used to re-engineer the manufacturing process for industrial metal machining applications.
For more information, visit our website at www.americhiplacc.com or; contact investor relations at 905-898-2646 or email r.windsor@americhiplacc.com.
This release may include projections of future results and "forward-looking statements" as that term is defined in Section 27A of the Securities Act of 1933 as amended (the "Securities Act"), and Section 21E of the Securities Exchange Act of 1934 as amended (the "Exchange Act"). All statements that are included in this release, other than statements of historical fact, are forward-looking statements. Although management believes that the expectations reflected in these forward-looking statements are reasonable; it can give no assurances that such expectations will prove to have been correct. Important factors that could cause actual results to differ materially from the expectations disclosed in this release, including, without limitation, in conjunction with those forward-looking statements contained in this release.
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