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Peak International Announces Breakthrough UltraLite™ Designs

Thursday, May 10, 2007

Hong Kong -- Peak International Limited (Nasdaq: PEAK), a market leader in plastics design, engineering, production and supply chain solutions, today announced the general availability of its breakthrough UltraLite™ packaging designs. UltraLite designs dramatically reduce the weight and cost of plastic products and their effect on logistic and supply chain costs versus traditional packaging designs. The company has filed patents and trademarks on the UltraLite design, process, and brand.

"As a market leader, we are committed to not only providing high quality, environmentally friendly products, but we pride ourselves in our ability to continuously reinvent the industry with investments in research and development," said Dean Personne, Peak's president and chief executive officer. "We view ourselves as an extension of each customer's business and therefore bear the responsibility of looking for ways to lower their overall cost of doing business."

A unique combination of tooling, process technology and materials, UltraLite was built to improve on existing packaging designs. Not only does UltraLite meet or exceed the performance of previous material and process combinations, but it is delivered with lower weight and overall product costs. The reduced weight translates into reduced air and ground shipping costs throughout the supply chain. This new process also reduces material waste and recycling volumes. The designs are optimized to industry recognized JEDEC standards, thus allowing the use of a single tray design for each package type. The ability to leverage a single design removes the cost and need for engineers and multiple trays to handle the same package.

"I would recommend this type of tray to all companies who are looking for a reduction in transportation costs beyond the standard JEDEC tray that exists on the market today," said Marc Papageorge, president of Semiconductor Outsourcing Solutions. "This breakthrough, lightweight design lowers the total cost of ownership for those companies who need to transport I.C. packages in trays."

With offices in Hong Kong, manufacturing facilities in Shenzhen (PRC), and distribution centers worldwide, Peak offers products already used by some of the world's largest companies for high-speed, automated manufacturing processes that require dimensional stability and precision tolerances. Peak has a wide array of standard packaging products, large manufacturing capacity, tooling and design expertise, and a worldwide footprint to support even the toughest JIT requirements.

About Peak International Limited

Peak International Limited is a leading supplier of precision-engineered packaging products for storage, transportation and automated handling of semiconductor devices and other electronic components. There are approximately 1,600 people who are working for Peak directly worldwide or indirectly in its factory in Shenzhen, the PRC, which is operated pursuant to a processing agreement with an unaffiliated party. Peak operates warehouses throughout the world and offers JIT services to leading semiconductor manufacturers and assemblers.

About Semiconductor Outsourcing Solutions

Semiconductor Outsourcing Solutions (SOS), a consulting service firm where technology, operations, and marketing disciplines come together. The company primarily provides consulting services to assist and support material and fabless semiconductor companies from I.C. package design starts through the product implementation and manufacturing phase. The company addresses a variety of assembly packaging device types including micro-processors, ASIC, FPLD, memory, modules, and MEMS which are used in a wide range of consumer and automotive applications. The Company was founded in 2003 and has consulting offices in Pleasanton, California and Manila, Philippines.

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