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Spatial Integrated Systems, Inc. Files Patent Application
Thursday, October 01, 2009
Kinston, NC -- Spatial Integrated Systems, Inc. ("SIS"), a leader in the development and integration of solutions incorporating next-generation digital 3D data capture and processing technologies, announced today that a United States patent application has been published for "system and method for generating structured light for 3-dimensional image rendering" under Publication No. US2009/0169095A1.
"We are pleased that our technical efforts have resulted in the filing of another patent application, reflecting the ingenuity of our design team," said Dr. Ali Farsaie, President and CEO of SIS. "This latest technology [3D SNAPSHOT] represents a significant leap forward in the area of three-dimensional rendering using cost-effective equipment," said Farsaie. SIS plans to use this new technology for applications such as biometrics, reverse engineering, robotics navigation, security and surveillance. SIS has preserved all rights to pursue broad international patent rights for this invention.
About SIS
With offices in NC, MD, VA, WV, and WA, and with federal and commercial customers throughout the US, SIS offers an integrated set of products and services supporting reverse engineering, design, prototyping, manufacturing integration, and IT. SIS provides high-end business solutions that incorporate Digital 3D Imaging, Robotics, Artificial Intelligence, and 3D Visualization technologies. SIS's process-based solutions are targeted at transitioning traditional manual and/or paper-based paradigms to an all-digital environment that enables users to realize significant cost savings, resource optimization, and efficiency improvements of an integrated data environment. For more information, visit http://www.sisinc.org.
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